Authors:
Clare Chou, Hawaii Xuan, Wade Huang, Bull Tsai
Abstract:
This disclosure proposes a sensor that can record the shock level during the shipping process to either protect our system or understand the status of the machine.
Background:
Product companies need to understand the actual shock level during product transportation. If any damage is found after receiving the product, it can be quickly analyzed as to whether it was caused during transportation. Ensure the product is shipped within the correct level of shock.
Description:
Our idea is to leverage the hall sensor or piezoelectrical material built into the system being shipped and record the shock level by time division and record in flash to ensure data integrity no matter what has happened. It might be triggered once there is a high predefined value being recorded. We will be able to ensure the product is shipped within the correct level of shock and ensure it's being delivered undamaged to our customers. If shock recorded is too high the packaging can be adjusted to keep the shock levels within the limits needed to insure the product arrives undamaged.
Related Art:
https://www.digikey.com/en/articles/fundamentals-of-piezoelectric-shock-and-vibration-sensors
https://s3vi.ndc.nasa.gov/ssri-kb/static/resources/space-packaging-134.pdf
https://masitek.com/protecting-your-shipments-the-ultimate-guide-to-shock-sensors/
TGCS Reference 00488
