Authors:
Joshua Fatcheric, Brad Johnson
Abstract:
This disclosure proposes using conductive ink printed on the internal flaps of an over-pack carton that contains multiple smaller boxes with conductive ink printed on the outer packaging creating a continuous circuit to provide indication of proper pack placement (based on tested standards), tampering evidence and monitoring of shipping damage.
Background:
One of the issues in shipping is the proper packing of multiple smaller boxes in a larger overpack box. There is a need to eliminate the improper re-packing of a primary packages into a secondary over-pack. A method to provide an added layer of tampering evidence is needed as well as a reduction of shipment damage based upon validated test data.
Description:
The conductive ink could be printed on the internal flaps during the manufacturing process of the carton. Similarly, on the primary pack conductive ink could be printed on the outer flaps of the carton. In over-pack situations where there are multiple packages in a larger carton this could help alert the operator if they are "packing correctly". A completed circuit could give indication of this. This provides a way to influence packaging format downstream so that if a certain product was intended to be positioned "this side up" it would be very clear it's being packed incorrectly when placed into the over-pack "upside down". This helps with right sizing the carton and has several peripheral added benefits such as increasing tampering evidence and understanding where shipping damage may have taken place. For instance, if a pothole is struck hard enough it may break the circuit in shipment creating a time and location to understand where that occurred. The ability to pinpoint when and where is a tremendous added benefit.
TGCS Reference 2530
